셀레스티카, 전력 효율적인 AI 파브릭을 위한 코패키지 옵틱스 탑재 DS6005 데이터센터 스위치 출시

Celestica Introduces the DS6005 Data Center Switch with Co-Packaged Optics to Enable Power-Efficient AI Fabrics New 102.4Tbps, 1.5OU fully liquid-cooled system is designed to increase bandwidth density and reduce power in OCP ORv3 deployments TORONTO, Oct. 12, 2026 (GLOBE NEWSWIRE) -- Celestica Inc. (NYSE: CLS) (TSX: CLS), a global leader in data center infrastructure and advanced technology solutions, today introduced the Celestica DS6005, a co-packaged optics (CPO) data center switching system designed to address the bandwidth density, power, latency, and reach requirements of next-generation AI data center networks. Built on the Broadcom Tomahawk 6 – Davisson switch chip, the DS6005 is designed to deliver up to 102.4Tbps of switching capacity in a compact 1.5OU form factor designed for OCP ORv3 racks. By co-packaging optical engines with the switch ASIC, the DS6005 eliminates the need for traditional front-panel pluggable optics, helping data center operators optimize bandwidth density, reduce latency, and improve power efficiency in the AI data center. "AI infrastructure is driving unprecedented demand for bandwidth, while power, thermal management, latency, and reach are becoming increasingly important constraints," said Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering, Celestica. "The DS6005 brings co-packaged optics, liquid cooling, field-replaceable external laser modules, and CPO-aware software management together in a compact platform designed to help customers build scalable and power-efficient AI fabrics." Purpose-built to support AI/ML scale up and scale out networking, the DS6005 is a fully liquid-cooled, co-packaged optics data center switch that slashes power consumption and improves cluster efficiency while lowering latency and increasing reliability for next-generation AI clusters. Key DS6005 features include: - Up to 102.4Tbps of switching capacity based on the Broadcom Tomahawk 6 – Davisson switch chip - CPO Architecture: Integrates optical engines directly onto the switch ASIC - 64 x 1.6TbE Ports (102.4T Capacity): Optically enabled 102.4Tbps of switching capacity to deliver bandwidth needs of AI clusters - Fully Liquid-Cooled ORv3 1.5OU: Improves temperature stability and reliability with increased overall rack density - SONiC Support: Achieves faster time to production using proven, open architecture that delivers AI fabric features and operational simplification Supporting Quotes "Moving co-packaged optics from an advanced architecture to a production-ready system requires collaboration across silicon, optical engines, packaging, thermal design, manufacturing, and system integration. By combining Broadcom's Tomahawk 6 – Davisson platform and optical expertise with Celestica's system engineering and platform execution, the DS6005 demonstrates how our partnership is helping bring CPO to market for AI networking. Celestica's work has been instrumental in translating our technology into a platform designed for high-density AI fabrics," said Manish Mehta, Vice President of Marketing and Operations, Optical Systems Division, Broadcom.