브로드컴·오라클·스페이스X, AI 하드웨어를 위해 사채 크레딧 활용 💬 공유하기
🇰🇷 한글 번역
월스트리트저널(WSJ)은 브로드컴이 오픈AI와 공동 개발 중인 맞춤형 AI 칩을 위한 500억 달러 이상의 자금 조달을 최근 몇 주 동안 준비해 왔다고 보도했다.
📄 원문 (English)
Broadcom has been working in recent weeks to arrange more than $50 billion in financing for a custom AI chip it is developing with OpenAI, The Wall Street Journal reported.
▶ 칩 라이브 24 홈으로 — chiplive24.com 💬 공유하기
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