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로움 반도체, 후공정 칩 제조 아웃소싱 확대

EE Times · 2026.10.08 16:18 · 원문 사이트
🇰🇷 한글 번역
일본의 반도체 제조업체 로움 세미컨덕터는 기존 제품과 현지 수요를 중심으로 아웃소싱 반도체 조립 및 테스트(OSAT) 시설의 활용을 확대하고 있으며, 웨이퍼 제조는 계속 자체적으로 유지할 계획이다.
📄 원문 (English)
Japanese chipmaker Rohm Semiconductor is expanding its use of outsourced semiconductor assembly and test (OSAT) facilities, starting with existing products and local demand while continuing to keep wafer
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