글로벌파운드리와 TSMC, 차세대 AI 패키징용 실리콘 인터포저 미국 공급을 위한 20억 달러 장기 계약 체결

Embedded Computing Design · 2026.10.14 01:19 · 원문 사이트

🇰🇷 한글 번역

글로벌파운드리와 TSMC, 첨단 AI 패키징을 위한 실리콘 인터포저의 미국 내 공급을 위해 다년간 20억 달러 규모 계약 체결 임베디드 컴퓨팅 디자인

📄 원문 (English)

GlobalFoundries and TSMC Reach Multi-Year $2 Billion Agreement to Establish U.S.-Based Supply of Silicon Interposers for Advanced AI Packaging    Embedded Computing Design

▶ 칩 라이브 24 홈으로 — chiplive24.com

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